HAZRA, M.; SINGH, S. Failure Analysis of Diode Components of Electronic Relay Packages Via Thorough Microstructural Characterization. International Journal of Engineering Materials and Manufacture, [S. l.], v. 4, n. 3, p. 124–136, 2019. DOI: 10.26776/ijemm.04.03.2019.05. Disponível em: https://www.deerhillpublishing.com/index.php/ijemm/article/view/90. Acesso em: 28 mar. 2024.